Devcon Wet Surface Rapair Putty

Product Description

Devcon Underwater Repair Putty Provide in India

DEVCON EPOXY PUTTIES :

Devcon Plastic Steel Putty A :  Bonds to most materials with a tough finish, excellent resistance to oil, Petrol, water and many other chemicals. Resistance max 121 degree centigrade

Devcon Plastic Steel 5 Min Putty SF : Fast curing grade of the original steel filled epoxy putty for permanent emergency repairs and use at low temperatures.

Seals Oil Transformer Leakages, Arrest online Leakages, Can also be used for underwater leak arrests. Temperatures. Resistance Max 93 Degrees Centigrade

Devcon Titanium Putty :  Titanium reinforced epoxy putty for making repairs that can be precision machined, Also Seals Cracked Welded joints in Pressure Vessels . Temperatures. Resistance Max 177 Degrees Centigrade

Devcon Brushable Ceramic Blue and Red : Ceramic filled, brush able epoxy that provides a smooth, protective barrier against abrasion, erosion and chemical attack, Rebuilds and seals heat exchanger tubes and protects pump casings and flange faces .Temperatures. Resistance Max 177  Degrees Centigrade

Devcon Wet Surface Repair Putty UW :  Water resistant putty for repairing, patching and rebuilding equipment in under water or habitually wet environments. Temperatures. Resistance Max 93 Degrees Centigrade

Devcon Magic Bond : Instantly Seals leaks and repairs gouges in steel, aluminum, wood, fiberglass, concrete and ceramics. Can be applied on damp surfaces.

Devcon Aluminum Putty F :  Aluminum filled epoxy putty for cost effective repairs to aluminum castings & Equipments, Temperatures. Resistance Max 121 degrees Centigrade

Devcon Bronze Putty BR : Bronze filled epoxy putty for repairing bronze and brass machinery parts, castings, bushes and shafts when brazing is not possible Temperatures. Resistance Max 121 degrees Centigrade

Devcon Stainless Steel Putty ST : Stainless steel filled epoxy putty

Devcon Flexane 80 : Rubber Coating in Brush able form to Repair Rubber linings, Rubber Coatings.